This product is a high-performance LED light source curing system consisting of a 395 nanometer light emitting head and an intelligent electronic control box, using COB integrated packaging technology for optical lenses. By directly integrating multiple high-power UV LED chips on the same substrate, it achieves more uniform light emission, ultra-high light intensity output, strong curing penetration, and fast speed. At the same time, it greatly reduces the thermal resistance path between the light emitting surface and the substrate, and has the dual advantages of ultra-high light intensity and excellent heat dissipation.
