Are you still struggling with uneven curing, substrate overheating, or high maintenance costs in your screen printing workflow?
Dongguan Landun Electromechanical is proud to unveil its latest UV LED curing module, featuring advanced COB (Chip-on-Board) packaging technology. Designed specifically for demanding screen printing and inkjet applications, this system addresses the key industry challenges of heat damage and inconsistent exposure.
Product performance advantages
✅ Unmatched Uniformity: Multi-chip COB integration ensures densely packed, parallel emission. The light intensity difference between the edge and the center is < 10%.
✅ Extreme Intensity: Delivers a stable surface output of ≥ 50,000 mW/cm²,perfect for high-speed, thick-film ink curing.
✅ Cold Source Innovation: Low infrared emission keeps workpiece temperatures low, making it 100% safe for heat-sensitive films and substrates.
✅ Instant Action: "Instant On" capability—reaches 100% power immediately. No warm-up, no downtime.
✅ Long Lifespan: Rated for ≥ 15,000 hours with minimal maintenance, drastically reducing total cost of ownership.
✅ Green & Safe: Mercury-free and ozone-free—built for a sustainable, compliant workshop.
✅ Smart Control Box: Full protection (Over-voltage/Over-current/Over-heat) with 0–100% adjustable power. Supports Local/Remote/External terminal & communication modes for seamless automation.
Application scenarios
Specially designed for UV screen printing ink curing, widely used in various industrial production scenarios such as packaging printing, label printing, plastic/glass substrate screen printing, electronic pattern printing, etc, especially suitable for curing processes that require strict speed and quality requirements.
